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Coating

We offer the deposition of conducting and insulating films by

  • Physical Vapor Deposition
  • Plasma-Enhanced Chemical Vapor Deposition
  • Screen Printing 

Physical Vapor Deposition (PVD) by Magnetron Sputtering and Electron Beam Deposition

Can be applied to different materials: 

  • Conductive materials: Aluminum (Al), titanium (Ti), platinum (Pt), tantalum (Ta):
    • Thickness from 20 to 200 nanometers.
    • Resistance in the micro ohm range.
    • Patterning by lift-off and etching technologies.
    • Single-layer or multi-layer coating of these materials.
  • Conductive and transparent material ITO-90/10 (90% indium oxide In2O3 and 10% tin oxide SnO2):
    • Thickness from 20 to 200 nanometers.
    • Resistance from 30 to 50 ohms.
    • Patterning by lift-off and etching technologies.
  • Evaporated quartz SixOy, coated at 150° C.

 

Platinum Electrode Structure   Platinum Heater Structure   Aluminum Electrode Structure   Gold Electrode Structure
Platinum electrodes on glass
   Thin film platinum resistors on a cantilever silicon nitride membrane
   Aluminum metallization on a silicon chip   Gold electrodes on glass

Plasma Enhanced Chemical Vapor Deposition (PECVD)

  • Silicon oxide SiO2, silicon nitride Si3N4 and low stress oxinitride SixOyNz as alternative insulator materials:
    • Thickness from 20 nanometers to 1.5 microns.
    • Patterning by RIE dry etching and wet chemical etching.
  • Hydrofluorocarbon CxFy layers. Material similar to Teflon®:
    • Thickness range from 50 nano meters to 2 microns.
    • Patterning by O2 RIE plasma etching.

PVD and PECVD applies to all kind of substrates up to 4 inch diameter.

Gold Electrodes   Coated Grid
Silicon oxide passivation on platinum electrodes (note the different color of the opened pads)
SEM image of a coated grid (2 microns CxFy). The grid is part of a filter structure. Hydrophobicity of one side was enhanced by PVD coating. Such grid can be used as one-way lock for tangential fluid flows.

Screen Printing

  • Dispensing of the state of the art adhesives on printed circuit boards and micro system substrates for surface mounted device packaging.
  • Dispensing of silicon rubber.
  • Includes sieve design and production.
  • Typical thickness of printed materials in the range of 15 to 35 microns.