Photolithography

One and double-side photolithography available on glass, silicon and ceramics.

• Max. substrate size 4 inches
• Substrate thickness from 150 to 1500 microns
• Dry and wet photo resists, 0.3 to 150 microns thick
• Photo epoxy SU8, 10 to 25 microns thick (Also as channel wall)

Double-side exposure machine