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Wafer Dicing

We accept flat wafers with diameters up to 6 inch, furthermore tubes and objects of other geometries (please ask).

Substrate Materials

  • Silicon (up to 2 mm thick)
  • Different glasses (up to 1.5 mm thick)
  • Different Ceramics (up to 1.5 mm thick)
  • Stainless Steel (up to 1.0 mm thick)
 

Support

  • Pressure sensitive tapes
  • UV-curing tapes
  • Dicing wax
 

Example:

TEM sample preparation 

Small Capillaries Glass wafer TEM sample
Glass capillary, diced into pieces of 1.5 mm length.
 Miniature mirrors, diced from a metallized 4 inch glass wafer.